Meno zhromaždenia : International spring seminar on electronics technology 47. May 15-19, 2024 Prague, Czech Republic Trends in Electronics Manufacturing, Interconnection Technology and Microelectronics Packaging Druh súboru : akcie Odkazy : \q2479*stu_us_cat*1 stu_us_auth*0122572*brz \q (1) - zborník (príspevkov)