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Fast 3-D electrothermal device/circuit simulation of power superjunction MOSFET based on SDevice and HSPICE interaction
CREPC201502 CREPC201503 CREPC201506 Title statement Fast 3-D electrothermal device/circuit simulation of power superjunction MOSFET based on SDevice and HSPICE interaction Main entry-name Chvála, Aleš, 1981- (Author) - FEI Ústav elektroniky a fotoniky Another responsib. Donoval, Daniel, 1953- (Author) - FEI Ústav elektroniky a fotoniky Marek, Juraj, 1983- (Author) - FEI Ústav elektroniky a fotoniky Príbytný, Patrik, 1985- (Author) - FEI Ústav elektroniky a fotoniky Molnár, Marián, 1986- (Author) - FEI Ústav elektroniky a fotoniky Mikolášek, Miroslav, 1983- (Author) - FEI Ústav elektroniky a fotoniky In IEEE Transactions on Electron Devices. -- Vol. 61, Iss. 4 (2014), s. 1116-1122 Language English Document kind RBX - článok z periodika Category ADC - Scientific titles in foreign carented magazines and noticed year-books Category (from 2022) V3 - Vedecký výstup publikačnej činnosti z časopisu Year 2014 Citations [1] 2014: DE FALCO, G. - Riccio, M. - Breglio, G. - Irace, A. Thermal-aware design and fault analysis of a DC/DC parallel resonant converter. In MICROELECTRONICS RELIABILITY, 2014, vol. 54, no. 9-10, pp. 1833-1838. ISSN 0026-2714. [1] 2016: CODECASA, Lorenzo - DALESSANDRO, Vincenzo - MAGNANI, Alessandro - IRACE, Andrea. Circuit-based electrothermal simulation of power devices by an ultrafast nonlinear MOR approach. In IEEE Transactions on Power Electronics, 2016-08-01, 31, 8, pp. 5906-5916. ISSN 08858993. [1] 2016: KUMAR, V. V. Siva. Nanocrystalline diamond films growth by microwave ECR CVD: Studies of structural and photoconduction properties. In VACUUM, 2016, vol. 131, no., pp. 259-263. ISSN 0042-207X. [1] 2016: CASPER, Thorben - DE GERSEM, Herbert - SCHOEPS, Sebastian. Automatic Generation of Equivalent Electrothermal SPICE Netlists from 3D Electrothermal Field Models. In 2016 17TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2016, vol., no., pp. [1] 2017: ABOMAILEK, Carlos - RIBA, Jordi-Roger - CAPELLI, Francesca - MORENO-EGUILAZ, Manuel. Fast electro-thermal simulation of short-circuit tests. In IET GENERATION TRANSMISSION & DISTRIBUTION, 2017, vol. 11, no. 8, pp. 2124-2129. ISSN 1751-8687. [1] 2018: CODECASA, Lorenzo - BORNOFF, Robin - DYSON, James - D'ALESSANDRO, Vincenzo - MAGNANI, Alessandro - RINALDI, Niccolo. Versatile MOR-based boundary condition independent compact thermal models with multiple heat sources. In MICROELECTRONICS RELIABILITY, 2018, vol. 87, no., pp. 194-205. ISSN 0026-2714. [1] 2018: ZUBERT, Mariusz - RASZKOWSKI, Tomasz - SAMSON, Agnieszka - ZAJAC, Piotr. Methodology of determining the applicability range of the DPL model to heat transfer in modern integrated circuits comprised of FinFETs. In MICROELECTRONICS RELIABILITY, 2018, vol. 91, no., pp. 139-153. ISSN 0026-2714. [1] 2019: CASPER, Thorben - DUQUE, David - SCHOEPS, Sebastian - DE GERSEM, Herbert. Automated netlist generation for 3D electrothermal and electromagnetic field problems. In JOURNAL OF COMPUTATIONAL ELECTRONICS, 2019, vol. 18, no. 4, pp. 1306-1332. ISSN 1569-8025. [1] 2021: TONG, Xin - LIU, Siyang - SUN, Weifeng - WU, Jianhui - YANG, Zhuo - ZHU, Yuanzheng - NI, Lihua. New Failure Mechanism Induced by Current Limit for Superjunction MOSFET Under Single-Pulse UIS Stress. In IEEE TRANSACTIONS ON ELECTRON DEVICES, 2021, vol. 68, no. 7, pp. 3483-3489. ISSN 0018-9383. [1] 2021: SCOGNAMILLO, Ciro - CATALANO, Antonio Pio - RICCIO, Michele - D'ALESSANDRO, Vincenzo - CODECASA, Lorenzo - BORGHESE, Alessandro - TRIPATHI, Ravi Nath - CASTELLAZZI, Alberto - BREGLIO, Giovanni - IRACE, Andrea. Compact Modeling of a 3.3 kV SiC MOSFET Power Module for Detailed Circuit-Level Electrothermal Simulations Including Parasitics. In ENERGIES, 2021, vol. 14, no. 15, pp. [1] 2021: TAGHIKHANI, Parastoo - BUISMAN, Koen - VERSLEIJEN, Martin - PEREZ-CISNEROS, Jose-Ramon - FAGER, Christian. Temperature-Dependent Characterization of Power Amplifiers Using an Efficient Electrothermal Analysis Technique. In IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2021, vol., no., pp. ISSN 0018-9480. 2024: TAMBONE, R. - FERRARA, A. - SIEMIENIEC, R. - WOOD, A. - MAGRINI, F. - HUETING, R. J. E. Ruggedness of Silicon Power MOSFETs-Part II: Device Design Failures and Modeling: A Review. In: IEEE TRANSACTIONS ON ELECTRON DEVICES, 2024, vol. 71, no. 6, pp. 3458-3469. ISSN 0018-9383. 
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