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Study of Ti Effect in Solder Type In-Ag-Ti on Bond Formation with Ceramic Materials by Use of Hybrid Soldering Process - Laser/Ultrasound
- active solder. microstructure. soldering. laser beam. ultrasonic. ceramicsKostolný, Igor, 1988- Study of Ti Effect in Solder Type In-Ag-Ti on Bond Formation with Ceramic Materials by Use of Hybrid Soldering Process - Laser/Ultrasound / aut. Igor Kostolný, Tomáš Meluš, Roman Koleňák, Paulína Babincová, Michal Šimek. -- A-. -- 10.15866/ireme.v15i6.21048. -- 2-s2.0-85117272074. Meluš, Tomáš, 1995-. Koleňák, Roman, 1973-. Babincová, Paulína 1988. Šimek, Michal In: International Review of Mechanical Engineering. -- ISSN 1970-8734. -- Vol. 15, iss. 6 (2021), s. 287-293.
Number of the records: 1