Current Research in Transient Liquid Phase Bonding Materials and Joint Reliability for Power Chip Packaging /

Number of the records: 1

Current Research in Transient Liquid Phase Bonding Materials and Joint Reliability for Power Chip Packaging

Title statement	Current Research in Transient Liquid Phase Bonding Materials and Joint Reliability for Power Chip Packaging / aut. X Liu, H Xu, H Li, Erika Hodúlová, Ingrid Kovaříková
Main entry-name	Liu , X. (Author)
Another responsib.	Xu, H. (Author)
	Li , H. (Author)
	Xu, J. (Author)
	Hodúlová, Erika, 1978- Z2 (Author) - MTF Katedra zvárania a spájania materiálov
	Kovaříková, Ingrid, 1975- Z2 (Author) - MTF Katedra zvárania a spájania materiálov
Note	A-
In	Materials Review. -- ISSN 1005-023X. -- Vol. 35, iss. 19 (2021), s. 116-124
Subj. Headings	High-temperature packaging
	Power chip
	solder
	Structural Reliability
	Transient liquid phase bonding
Language	English
URL	http://www.mater-rep.com/EN/lexeme/showArticleByLexeme.do?articleID=4256
Document kind	RBX - článok z periodika
Category	ADM - 13/NOVÉ Vedecké práce v zahraničných časopisoch registrovaných v databázach Web of Science alebo SCOPUS
Category (from 2022)	V3 - Vedecký výstup publikačnej činnosti z časopisu
Type of document	článok
In databases
Year	2021

article

citace PRO

Number of the records: 1