Characterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite  /

Number of the records: 1

Characterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite

Title statement	Characterization of Sn–Sb–Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu–SiC Metal–Ceramic Composite / aut. Roman Koleňák, Igor Kostolný, Jaromír Drápala, Paulína Babincová, Matej Pašák
Main entry-name	Koleňák, Roman, 1973- (Author) - MTF Katedra zvárania a spájania materiálov
Another responsib.	Kostolný, Igor, 1988- Z2 (Author) - MTF Katedra zvárania a spájania materiálov
	Drápala, Jaromír (Author)
	Babincová, Paulína 1988 Z2 (Author) - MTF Ústav materiálov
	Pašák, Matej, 1985- Z1 (Author) - MTF Ústav materiálov
Note	A+
In	Materials [elektronický zdroj]. -- ISSN 1996-1944. -- Vol. 14, iss. 21 (2021), s.1-22
Subj. Headings	ultrasonic
	intermetallic compounds
	solder
	composite
Language	English
URL	https://www.mdpi.com/1996-1944/14/21/6369
Document kind	RBX - článok z periodika
Category	ADC - Scientific titles in foreign carented magazines and noticed year-books
Category (from 2022)	V3 - Vedecký výstup publikačnej činnosti z časopisu
Type of document	článok
In databases
Year	2021

article

citace PRO

Number of the records: 1